14860 Circuit Card Assembly

DEPT OF DEFENSE

Notice type
Combined Synopsis/Solicitation
Solicitation #
14860
NAICS
334418
PSC
5998
Set-aside
Total Small Business Set-Aside (FAR 19.5)
Posted
June 11, 2026
Response due
June 24, 2026
Place of performance
Hill Air Force Base, UT

What this opportunity is

The Department of Defense is issuing a Combined Synopsis/Solicitation for a Circuit Card Assembly Blank Purchase Agreement, which is a Total Small Business Set-Aside opportunity under NAICS code 334418. This solicitation suits small businesses capable of producing circuit card assemblies. The notice type indicates that the solicitation will be a formal procurement, requiring bidders to submit a formal proposal, rather than a simplified acquisition process. The place of performance is specified as Utah.

Analysis by Mindy, grounded in the SAM.gov notice.

Description

i PERFORMANCE-BASED WORK STATEMENT (PWS) CIRCUIT CARD ASSEMBLY BLANKET PURCHASE AGREEMENT (BPA) U.S AIR FORCE 5/6/2026 Version 1 PWS Modification History -- 1 of 8 -- ii Date Change Paragraph # -- 2 of 8 -- iii TABLE OF CONTENTS 1 DESCRIPTION OF SERVICES ............................................................................................. 1 2 SCOPE..................................................................................................................................... 1 3 Reference documents and Standards ....................................................................................... 1 3.1 Applicable Documents and Standards ..................................................................................... 1 3.2 Government Furnished Equipment (GFE). ............................................................................. 2 4 REQUIREMENTS .................................................................................................................. 2 4.1 GENERAL REQUIREMENTS .............................................................................................. 2 4.2 PCB FABRICATION REQUIREMENT ................................................................................ 2 4.3 COMPONENT PROCUREMENT REQUIREMENT ............................................................ 3 4.4 PCB ASSEMBLY REQUIREMENT………………………………………………………..3 5 SERVICE SUMMARY ........................................................................................................... 4 6 Place/ period of performance .................................................................................................. 4 6.1 Place of Performance............................................................................................................... 4 6.2 Period of Performance……………………………………………………………………….4 7 Program Management ............................................................................................................. 5 7.1 Data Rights Management. ....................................................................................................... 5 7.2 Government Furnished Property ............................................................................................. 5 7.3 Quality Control Plan................................................................................................................ 5 7.4 Quality Assurance. .................................................................................................................. 5 7.5 Conflicts of Interest. ................................................................................................................ 5 -- 3 of 8 -- Page 1 of 2 1 DESCRIPTION OF SERVICES This requirement is to obtain electronic parts and products from industry and commercial Printed Circuit Boards (PCB) Fabrication and/or Assembly companies. This supports the 516th Common Aircraft Portable Reprogrammable Equipment (CAPRE), Common Built- in-Test Reprogramming Equipment and Portable Automated Test Station (CMBRE), Portable Automated Test Station (PATS) and similar missions. The requirement includes developing electronics solutions that solve Department of War (DoW) obsolescence issues and/or provides state-of-the-art hardware and software solutions to DoW Programs. This Performance Work Statement (PWS) will fill the need to (1) rapidly produce Printed Circuit Board Assemblies (PCBAs) for initial design and development use, (2) quickly produce prototype PCBAs for design validation, and (3) manufacture high-quality PCBAs for use in DoW operational environments. 2 SCOPE The scope of this PWS is to enable the ordering of Printed Circuit Board Assemblies (PCBAs) through a turn-key solution for Printed Circuit Board (PCB) Fabrication and Assembly with multiple vendors. This is applicable to developmental, prototype, and production electronics systems for use by Department of War (DOW) Programs. 3 REFERENCE DOCUMENTS AND STANDARDS 3.1 Applicable Documents and Standards: The following documents will be provided at time of task order. The contractor shall comply with the following documents. Document Number Document Title Date of Document PCB Design and Layout Files As Provided PCB Fabrication Specification As Provided Sub-component Bill of Materials (BOM) As Provided PCB Assembly Design Files As Provided PCB Assembly Specifications As Provided -- 4 of 8 -- Page 2 of 3 3.2 Government Furnished Equipment (GFE): The Government may provide Electronic Components necessary for the Contractor to assemble PCBAs. Any components provided by the Government to the contractor shall be identified in a Government Furnished Material (GFM) list, which is a subset of the production Bill of Materials (BOM) required to complete fabrication and assembly. The GFM and BOM may be consolidated into a single list (BOM) so long as quantities of GFM are sufficiently annotated within the BOM. 4 REQUIREMENTS 4.1 GENERAL REQUIREMENTS: The contractors shall produce/procure the products described within Section 4, based on the required specification provided by the Government through individual BPA calls. The contractor shall have in-house capabilities for either PCB Fabrication or Assembly, or both. 4.2 PCB FABRICATION REQUIREMENT: The contractor shall produce requested quantities of PCBs IAW fabrication requirements and specification documents for board thickness, layer count, surface finish, trace tolerance, and any other pertinent fabrication specifications. 4.2.1 The contractor shall fabricate PCBs IAW specified IPC-A-600 classification; if IPC Classification is not specified in the provided Technical Data Package (TDP), the contractor shall fabricate PCBs to IPC Class 3 requirements. 4.2.2 The contractor shall provide technical reports, as required, documenting electrical continuity test results, impedance matching test results, and results of Quality Control inspections. 4.2.2 Unless otherwise specified in the

Source: SAM.gov, as posted. Verify the current solicitation before responding.

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