Circuit Card Assemblies

DEPT OF DEFENSE

Notice type
Combined Synopsis/Solicitation
Solicitation #
N0016426Q0209
NAICS
334418
PSC
5998
Set-aside
No Set aside used
Posted
August 7, 2026
Response due
August 14, 2026
Place of performance
Crane, IN

What this opportunity is

The Department of Defense is procuring Circuit Card Assemblies (CCAs) to support the AN/SPS-73 system, requiring the contractor to source electronic components and assemble them onto government-furnished bare circuit cards. This opportunity is open to all businesses as there is no set-aside, making it suitable for small and large contractors alike. Interested vendors should note that this is a combined synopsis/solicitation, indicating they should track the notice for potential bidding opportunities rather than submitting proposals immediately.

Analysis by Mindy, grounded in the SAM.gov notice.

Description

1.0 Scope This Statement of Work (SOW) defines the requirements for the procurement of electronic components and the subsequent manufacturing and assembly of Circuit Card Assemblies (CCAs) to support AN/SPS-73 system. The government requires the company to procure all components identified in the attached bill of materials. The company shall solder, attach, and mount all components onto a bare circuit card that will be supplied as GFM. 2.0 Applicable Documents • Attachment 1: Bill of Materials (BOM) • IPC J-STD-001, IPC-A-610 Class 2 • Provide drawings 3.0 Requirements The Contractor shall be responsible for the procurement of all electronic components, hardware, and associated materials strictly as identified in the attached Bill of Materials (BOM). The Contractor must ensure all procured components meet build to specifications, manufacturer part numbers (or pin for pin compatible components), and tolerances outlined in the BOM. The Contractor shall ensure supply chain integrity to prevent the procurement of counterfeit parts. The Contractor shall solder, attach, and properly mount all procured components onto the GFM bare circuit cards. All manufacturing and soldering processes shall be executed in accordance with standard commercial best practices and applicable industry standards for electronic assemblies. Upon completion of the assembly process, the Contractor shall perform necessary visual and/or automated inspections to verify that all components are correctly populated, oriented, and securely soldered to the bare circuit cards without defects (e.g., bridging, cold solder joints, missing components). 4.0 Government Furnished Material (GFM) The Government will provide Government Furnished Material (GFM)—including necessary bare circuit cards—when the Contractor requires special or specific material to perform specific tasking, or as lay-in material for repairs, refurbishments, and system upgrades. All planned GFM will be identified on a Government Furnished Property (GFP) attachment for each applicable contract. Upon receipt of any GFM, the Contractor shall verify the delivery, perform a visual inspection for transit damage or defects, and immediately notify the Government of any discrepancies before commencing assembly. Furthermore, the -- 1 of 2 -- Contractor must maintain a complete and accurate listing of all serial-managed operating materials and supplies where the title is vested in the Government. (CDRL A001) 5.0 Data Deliverables The contractor shall submit the following data deliverable in accordance with the requirements listed in the Contract Data Requirements List (CDRLs). CDRL: A001 DID Number: DI-MGMT-80441 DID Title: Government Property (GP) Inventory Report SOW Paragraph: 4.2 6.0 Special Conditions The Contractor shall package and deliver the final, fully assembled Circuit Card Assemblies to the Government. -- 2 of 2 --

Source: SAM.gov, as posted. Verify the current solicitation before responding.

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