PCB board fabrication and assembly

NATIONAL AERONAUTICS AND SPACE ADMINISTRATION

Notice type
Combined Synopsis/Solicitation
Solicitation #
80NSSC26934342Q
NAICS
334412
PSC
5999
Posted
June 2, 2026
Response due
June 4, 2026

What this opportunity is

NASA is seeking the fabrication and assembly of 150 custom FPGA interface PCBs, which will support advanced aerospace electronics and embedded processing architectures. This opportunity is suitable for small businesses under NAICS 334412, as it involves specialized manufacturing and assembly capabilities. The notice type is a Combined Synopsis/Solicitation, indicating that interested vendors should prepare to submit proposals rather than simply track the opportunity for future bidding.

Analysis by Mindy, grounded in the SAM.gov notice.

Description

Statement of Work FPGA Interface Board Fabrication and Assembly Production A. Background/History of Requirement: NASA Ames is conducting advanced embedded systems and avionics development activities involving FPGA- based processing, high-speed communication interfaces, and distributed compute architectures. Key to this work is the development of a custom FPGA interface board capable of supporting Ethernet networking, USB boot/debug functionality, Raspberry Pi integration, and precision power monitoring in a compact embedded system. NASA seeks fabrication and assembly of 150 custom interface PCBs designed around the Enclustra Mars ZX3 FPGA module. These boards will support ongoing research and prototype system development activities related to advanced aerospace electronics and embedded processing architectures. B. Description of item(s) to be purchased: The items to be purchased are 150 assembled custom FPGA interface PCBs including fabrication, assembly, inspection, and electrical verification. The boards contain high-density FPGA interconnects, controlled- impedance differential routing, Ethernet magnetics integration, USB interfaces, precision power monitoring circuitry, and multiple embedded compute interfaces. C. Requirements Specifications: 1. PCB Fabrication a) Controlled impedance differential pair routing for Ethernet and USB interfaces within .005 inches of accuracy b) High-density fine-pitch fabrication suitable for FPGA carrier board applications c) Fabrication tolerances sufficient to maintain signal integrity and reliable FPGA operation d) Electrical continuity and shorts testing required on all boards 2. PCB Assembly a) Assembly of all provided components including FPGA module connectors, Ethernet magnetics, USB connectors, current sense circuitry, and supporting passive components b) Inspection and verification of fine-pitch solder joints and high-density interfaces d) Vendor responsible for maintaining manufacturing consistency across all production units 3. Period of Performance: Offerors to propose the fastest possible fabrication, assembly, inspection, and delivery schedule for all 150 boards. -- 1 of 1 --

Source: SAM.gov, as posted. Verify the current solicitation before responding.

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