PCB FABRICATION AND ASSEMBLY OF HPSC PROCESSOR CARD

STATEMENT OF WORK 1. Objective/Requirements 2. The purpose of this purchase is to acquire 6 HPSC main board PCBs and assembly of one HPSC brass board. 3. Characteristics, Scope, and Specs 3.1. SCOPE This Statement of Work (SOW) defines the requirements for the fabrication, assembly, and delivery of high-reliability, 22-layer Printed Circuit Boards (PCBs) for autoNGC HPSC design IRAD. The vendor shall provide all necessary materials, equipment, and labor to manufacture six (6) bare boards, perform component assembly on one (1) of those boards, and deliver the final products within the required timeframe. 3.2. DELIVERABLES AND TIMELINE Fabrication Quantity: Six (6) bare PCBs (22 layers). Assembly Quantity: One (1) fully assembled PCB. Unassembled Quantity: Five (5) bare PCBs. Delivery Schedule: All bare boards and the one (1) assembled board must be fabricated, assembled, tested, and delivered within twenty (20) calendar days after the receipt of the order (ARO), finalized manufacturing files, and receipt of all components. (Note to user: adjust timeline here if assembly requires additional time). 3.3. APPLICABLE DOCUMENTS AND STANDARDS (FABRICATION) The vendor shall ensure that all fabrication, testing, and inspection processes comply with the latest revisions of the following standards: 3.3.1. Drafting Standards NASA/GSFC 500-PG-8700.2.5 3.3.2. Design Standards IPC-2221, Class 3 (Generic Standard on Printed Board Design) IPC-2222, Type 3 (Sectional Design Standard for Rigid Organic Printed Boards) 3.3.3. Qualification and Performance Standards IPC-6011, Class 3 (Generic Performance Specification for Printed Boards) IPC-6012ES, Type 3 (Space and Military Avionics Applications Addendum to IPC- 6012 for Rigid Printed Boards) 3.4. SPECIFIC FABRICATION REQUIREMENTS AND EXCLUSIONS The vendor shall fabricate the boards strictly adhering to the standards listed in Section 3.0, with the -- 1 of 2 -- following explicit exceptions and requirements applied to the IPC-6012ES (Type 3) qualification: Exclusion: Fungus Resistance testing (per IPC-6012 section 3.10.2) is NOT required. Requirement: Solderability testing (per IPC-6012 section 3.3.6) IS strictly required. 3.5. ASSEMBLY REQUIREMENTS The vendor shall assemble one (1) of the fabricated boards in accordance with the provided Bill of Materials (BOM) and assembly drawings. Components: [Specify whether the assembly is Turnkey (vendor procures all parts) or Consigned (NASA provides all parts as a kit).] Assembly Standards: Assembly and soldering shall be performed in accordance with [Insert applicable standard, e.g., IPC J-STD-001 Space Addendum, IPC-A-610 Class 3, or NASA-STD-8739.x]. Inspection: The assembled board shall undergo visual inspection and [Specify any other required inspections, e.g., Automated Optical Inspection (AOI) or X-Ray inspection for BGA/leadless components]. 3.6. QUALITY ASSURANCE AND REPORTING The vendor shall provide a Certificate of Conformance (CoC) verifying that all delivered PCBs (both bare and assembled) meet the requirements specified in this SOW and the applicable IPC/NASA standards. Required test reports (including solderability test results) and material certifications must accompany the physical delivery of the PCBs. 3.7. PACKAGING AND SHIPPING All bare and assembled PCBs shall be packaged in a manner that prevents physical damage, moisture ingress, and electrostatic discharge (ESD) damage during transit. The assembled board must be placed in a static-shielding bag compliant with standard aerospace handling procedures. -- 2 of 2 --