Sources Sought Low Temp Anodic Bonding Glass Wafers

Requirements / Specification Document Requirements / Specifications: Low Temperature Anodic Bonding Glass Wafers 1 Version 1.0 (2019) Double-click on  for further assistance. Use this document to detail specifications/requirements for an item and/or ancillary services.  TITLE: Low Temperature Anodic Bonding Glass Wafers  Requesting Lab/Division/Group: Physical Measurements Lab / Time and Frequency Division / Atomic Devices & Instrumentation Group General Statement of Need  Searching for special glass material/wafers for low temperature bonding with thermal expansion coefficient similar to Si. Items and/or Ancillary Services  Item 1: Glass Wafers Quantity: 10-50 Specifications: Specification 1.1, Glass wafer that enables low temperature anodic bonding at below 250 C 1.2, thermal expansion matchs Si to be within 20 ppm from 0-450 C 1.3, polished 4 inch diameter wafter with thickness of 0.7 mm and 3 mm available. Separately Priced Options and Services: Item 2: [List minimum specifications. Quantity: [Enter quantity here.] Specifications: [Enter quantity here.] [List any other item(s) or service requirements here using the same format above.] Service Requirements / Item Specifications Section  Requirements/Specifications  Planning Considerations ☒ N/A ☐ List any visits required to allow potential vendors to see site specific constraints. [Explain requirement here] ☐ US citizen required on-site (foreign nationals require preregistration 30 days prior) ☐ Vendor rep on-site more than three days ☐ Other considerations: [List other considerations to ensure an accurate quote] Shipping & Delivery ☒ N/A [Enter shipping and delivery information by item here.] Shipping criteria: ☐ Partial delivery acceptable ☐ Direct delivery to building required [Explain need for requirement here] Building has: ☐ Loading dock ☐ Containerization preference: [Choose container] Other requirements: [List any other requirements here] -- 1 of 4 -- Requirements / Specification Document Requirements / Specifications: Low Temperature Anodic Bonding Glass Wafers 2 Version 1.0 (2019) Double-click on  for further assistance. Delivery date criteria: ☐ Delivery of goods, installation, and training shall be completed no later than: [Insert date here] ☐ Deliver no earlier than: [Insert date here] ☐ Other: [List other shipping, delivery, or specil requirements] Electronic Media ☒ N/A [Enter electronic media requirements by item here.] ☐ Software ☐ Electronic manuals ☐ License Key ☐ Other: [List any other Electronic Media requirements here] [Enter email address for software delivery here] Installation ☒ N/A [Enter installation requirements by item here.] ☐ Vendor technician on site ☐ Rigging ☐ Uncrating / Unpackaging ☐ Removal of packaging material ☐ Equipment set up ☐ Start-up services ☐ Turn key installation ☐ Other [Enter details here.] Note: When installation is required, TPOC or COR shall be the coordination point. Facility / Utility Considerations ☒ N/A [List site specific utility considerations by item here.] ☐ OFPM Work Order Number(s) [List any Work Order Number(s) here] ☐ Power available Voltage: [Enter voltage here] (V) Max Current: [Enter max current draw here] (A) Phase: [Choose phase] Frequency: [Typically 60Hz] (Hz) NEMA Plug Type: [Enter plug type here] (i.e.: NEMA L5-20P) Environment: [Choose environment] Other power consideration: [List any other power considerations here] ☐ Utility connections: [List relevant available utilities, pressure(s), and flowrate(s)] ☐ Other considerations: [List other considerations to ensure an accurate quote] -- 2 of 4 -- Requirements / Specification Document Requirements / Specifications: Low Temperature Anodic Bonding Glass Wafers 3 Version 1.0 (2019) Double-click on  for further assistance. Warranty  ☒ N/A [Choose warranty type here.] [If you require an Extended Manufacturer Warranty, describe the warranty requirements per item here.] What is included? ☐ Labor ☐ Parts ☐ Travel ☐ Cost and liability for returns ☐ Other: [Enter other requirements here] ☐ Warranty length: [Enter warranty length here] Period Length:[Ex. month, 6 month, year etc.] Training ☒ N/A [Training requirements (who, when, what, where) here. If on-site, is travel necessary?] ☐ On-site ☐ Off-site location: [Enter location(s) here] ☐ Number of trainees: [Enter number of trainees here] Scope of training: ☐ Operations ☐ Maintenance ☐ Troubleshooting ☐ Safety ☐ Other: [Enter other scope requirements here] ☐ Training materials to be provided: [Describe requirement here] ☐ Other: [Enter other training requirements here] Note: When training is required, TPOC or COR shall be the coordination point. Inspection and Acceptance ☒ N/A [Enter inspection requirements per item here] ☐ Planned government acceptance testing (7 business days) ☐ Gov’t acceptance expected to take longer than 7 business days: [Duration] ☐ Inspection and acceptance plan: [Explain here] ☐ Other: [Enter other requirements here] Maintenance ☒ N/A [Describe your maintenance requirements per item here] Period Length: [Ex. month, 6 month, year etc.] What is included? ☐ Labor ☐ Spare parts ☐ Consumables ☐ Travel ☐ Cost and liability for returns ☐ Software updates ☐ Manuals ☐ Service plan length: [Enter service plan length here] ☐ Other: [Enter other requirements here] ☐ Requirements: [Enter requirements here] (i.e.: onsite within 72 hours, etc.) ☐ Option Period 1 ☐ Option Period 2 ☐ Option Period 3 ☐ Option Period 4 Government Furnished Material / Equipment ☒ N/A [List any government furnished material/equipment per item here] ☐ Samples for testing ☐ Government equipment which will leave gov't site (TPOC must coordinate with division property custodian) Serial Number: [Enter Serial Number here] Description: [Enter description here] -- 3 of 4 -- Requirements / Specification Document Requirements / Specifications: Low Temperature Anodic Bonding Glass Wafers 4 Version 1.0 (2019) Double-click on  for further assistance. 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