Federal Contractor Profile
Ozark Integrated Circuits INC
$18M obligated·23 awards·3 agencies·2 NAICS
Federal Contracts
Showing contracts 1–34 of 34 total. Sorted by action date, most recent first. Excludes $0 modifications.
| Date | Agency | PIID | NAICS | Description | Amount |
|---|---|---|---|---|---|
| Jul 25, 2024 | Department of DefenseDEF ADVANCED RESEARCH PROJECTS AGCY | HR001124C0373 | 541715 | THE HIGH OPERATIONAL TEMPERATURE SENSORS (HOTS)PROGRAM WILL DEVELOP A TECHNOLOGY FOR HIGH-BANDWIDTH, HIGH-DYNAMIC-RANGE SENSING AT HIGH TEMPERATURE. | $355K |
| Jun 17, 2024 | Department of DefenseDEF ADVANCED RESEARCH PROJECTS AGCY | HR001124C0373 | 541715 | THE HIGH OPERATIONAL TEMPERATURE SENSORS (HOTS)PROGRAM WILL DEVELOP A TECHNOLOGY FOR HIGH-BANDWIDTH, HIGH-DYNAMIC-RANGE SENSING AT HIGH TEMPERATURE. | $1.4M |
| May 21, 2024 | Department of DefenseDEF ADVANCED RESEARCH PROJECTS AGCY | HR001124C0373 | 541715 | THE HIGH OPERATIONAL TEMPERATURE SENSORS (HOTS)PROGRAM WILL DEVELOP A TECHNOLOGY FOR HIGH-BANDWIDTH, HIGH-DYNAMIC-RANGE SENSING AT HIGH TEMPERATURE. | $740K |
| Apr 3, 2024 | Department of DefenseFA2394 USAF AFMC AFRL PZL AFRL RXKM | FA239424CB022 | 541715 | SYSTEM INTEGRATION OF NON-VOLATILE FERROELECTRIC MEMORY FOR HIGH TEMPERATURE APPLICATIONS | $1.8M |
| Mar 6, 2024 | Department of DefenseDEF ADVANCED RESEARCH PROJECTS AGCY | HR001124C0373 | 541715 | THE HIGH OPERATIONAL TEMPERATURE SENSORS (HOTS)PROGRAM WILL DEVELOP A TECHNOLOGY FOR HIGH-BANDWIDTH, HIGH-DYNAMIC-RANGE SENSING AT HIGH TEMPERATURE. | $392K |
| Mar 1, 2024 | Department of DefenseDEF ADVANCED RESEARCH PROJECTS AGCY | HR001124C0373 | 541715 | THE HIGH OPERATIONAL TEMPERATURE SENSORS (HOTS)PROGRAM WILL DEVELOP A TECHNOLOGY FOR HIGH-BANDWIDTH, HIGH-DYNAMIC-RANGE SENSING AT HIGH TEMPERATURE. | $2.7M |
| Oct 3, 2023 | Department of DefenseMISSILE DEFENSE AGENCY (MDA) | HQ086024C7111 | 541715 | SBIR/STTR PHASE II R&D | $1.5M |
| Aug 16, 2023 | Department of DefenseW6QK ACC CCDC STTC | W912CG22C0024 | 541715 | NEW DARPA SBIR II TITLED "HIGH FIDELITY ANALOG INTEGRATION TECHNIQUES FOR HIGH TEMPERATURE APPLICATIONS" | $506K |
| Jun 5, 2023 | Department of DefenseNAVAIR WARFARE CTR AIRCRAFT DIV | N6833523C0358 | 541715 | KICK-OFF BRIEFING MATERIALS & FWA CERT. | $140K |
| Feb 24, 2023 | Department of DefenseW6QK ACC-RSA | W31P4Q21C0012 | 541715 | DARPA SMALL BUSINESS INNOVATION RESEARCH (SBIR) PHASE II EFFORT ENTITLED, "HIGH-TEMPERATURE INSTRUMENTATION FOR THE ADVANCEMENT OF HYPERSONIC ENGINE DEVELOPMENT" | $496K |
| Feb 7, 2023 | Department of DefenseW6QK ACC CCDC STTC | W912CG22C0024 | 541715 | NEW DARPA SBIR II TITLED "HIGH FIDELITY ANALOG INTEGRATION TECHNIQUES FOR HIGH TEMPERATURE APPLICATIONS" | $486K |
| Nov 21, 2022 | Department of DefenseW6QK ACC-RSA | W31P4Q21C0012 | 541715 | DARPA SMALL BUSINESS INNOVATION RESEARCH (SBIR) PHASE II EFFORT ENTITLED, "HIGH-TEMPERATURE INSTRUMENTATION FOR THE ADVANCEMENT OF HYPERSONIC ENGINE DEVELOPMENT" | $250K |
| Jul 22, 2022 | Department of DefenseMISSILE DEFENSE AGENCY (MDA) | HQ086022C7830 | 541715 | SBIR/STTR PHASE I RESEARCH & DEVELOPMENT PACKAGING METHODS FOR RELIABLE AND SCALABLE HIGH TEMPERATURE ELECTRONICS | $155K |
| Jul 6, 2022 | National Aeronautics and Space AdministrationNASA SHARED SERVICES CENTER | 80NSSC22PB137 | 541715 | EO14042 PHASE I HIGH TEMPERATURE ADDITIVELY MANUFACTURED ROM FOR VENUS SURFACE OPERATION | $156K |
| Jun 1, 2022 | Department of DefenseW6QK ACC CCDC STTC | W912CG22C0024 | 541715 | NEW DARPA SBIR II TITLED "HIGH FIDELITY ANALOG INTEGRATION TECHNIQUES FOR HIGH TEMPERATURE APPLICATIONS" | $500K |
| Apr 8, 2022 | Department of DefenseW6QK ACC-RSA | W31P4Q21C0012 | 541715 | DARPA SMALL BUSINESS INNOVATION RESEARCH (SBIR) PHASE II EFFORT ENTITLED, "HIGH-TEMPERATURE INSTRUMENTATION FOR THE ADVANCEMENT OF HYPERSONIC ENGINE DEVELOPMENT" | $495K |
| May 7, 2021 | Department of DefenseW6QK ACC-RSA | W31P4Q21C0012 | 541715 | DARPA SMALL BUSINESS INNOVATION RESEARCH (SBIR) PHASE II EFFORT ENTITLED, "HIGH-TEMPERATURE INSTRUMENTATION FOR THE ADVANCEMENT OF HYPERSONIC ENGINE DEVELOPMENT" | $500K |
| Mar 1, 2021 | Department of DefenseFA8650 USAF AFMC AFRL PZL AFRL/PZL | FA865021C7113 | 541715 | PACKAGING AND TEST OF LATERAL SIC INTEGRATED CIRCUITS FOR 800OC OPERATION | $238K |
| Feb 19, 2021 | Department of DefenseFA8649 USAF SBIR STTR CNTRCTNG AFRL | FA864921P0409 | 541715 | SUPERSONIC CAPABLE SIGNAL CONDITIONING ELECTRONICS FOR TURBINE ENGINES | $50K |
| Aug 30, 2020 | National Aeronautics and Space AdministrationNASA SHARED SERVICES CENTER | 80NSSC20C0282 | 541715 | HIGH FIDELITY ANALOG INTEGRATION TECHNIQUES FOR VENUS SURFACE DATA ACQUISITION | $125K |
| Jul 15, 2020 | Department of DefenseFA8649 USAF SBIR STTR CNTRCTNG AFRL | FA864920C0297 | 541715 | COVID-19 - HIGH TEMPERATURE BY DESIGN (HTBD) TECHNIQUES FOR A RELIABLE, HIGH PERFORMANCE MICROCONTROLLER | $750K |
| Jul 10, 2020 | National Aeronautics and Space AdministrationNASA SHARED SERVICES CENTER | 80NSSC20C0179 | 541715 | EXTREME ENVIRONMENT SYSTEM INTEGRATION TECHNIQUES FOR VENUS IN-SITU PROCESSING | $760K |
| Dec 12, 2019 | Department of the InteriorIBC ACQ SVCS DIRECTORATE (00004) | 140D0420C0034 | 541715 | HIGH-TEMPERATURE INSTRUMENTATION FOR THE ADVANCEMENT OF HYPERSONIC ENGINE DEVELOPMENT | $225K |
| Jul 29, 2019 | National Aeronautics and Space AdministrationNASA SHARED SERVICES CENTER | 80NSSC19C0185 | 541715 | NASA HAS INVESTED SIGNIFICANT TIME AND MONEY IN DEVELOPING HIGH-TEMPERATURE TECHNOLOGIES FOR VENUS SURFACE EXPLORATION. DUE TO THE HARSH ENVIRONMENT OUTSIDE AN INSULATED LANDER BODY (~462OC, 92 BAR PRESSURE, CO2 ATMOSPHERE), CONVENTIONAL, HIGH-TRL COMPONENTS AND MATERIALS WILL NOT SURVIVE, EVEN FOR A SHORT DURATION MISSION LASTING ONLY A FEW HOURS..TO MEET THIS NEED, OZARK IC HAS WORKED WITH NASA'S JFET-R INTEGRATED CIRCUIT TECHNOLOGY (UNDER LICENSE SINCE 2016) TO PROVIDE SENSING AND ACTUATION SOLUTIONS THAT CAN SURVIVE IN THIS HARSH ENVIRONMENT. HONEYBEE ROBOTICS (HBR) HAS BUILT AND TESTED SEVERAL MOTOR, SENSOR AND GEARBOX PROTOTYPES FOR A VENUS ROCK SAMPLING DRILL. THE DRILL INCLUDES TWO BLDC MOTORS TO DRIVE THE AUGER AND PERCUSSION MECHANISMS AND A STEPPER MOTOR TO DRIVE THE DRILL FEED STAGE...IN PHASE I OF THIS EFFORT, OZARK IC SHOWED, THROUGH A LABORATORY DEMONSTRATION, THAT NASA'S JFET-R TECHNOLOGY CAN CONTINUOUSLY RUN A STEPPER MOTOR FOR OVER 1,000 HOURS OF OPERATION AT 470OC. IN PARALLEL, HONEYBEE ROBOTICS DEMONSTRATED THAT ITS TRL-6 LEVEL VENUS MOTORS ARE CAPABLE OF BEING USED IN A STEPPER CONFIGURATION TO ACHIEVE THE REQUIRED AUGER NEEDS FOR A VENUS DRILL..WHAT REMAINS FOR PHASE 2 IS TO FABRICATE A COMBINED MOTOR CONTROL CHIPSET, ASSEMBLE MODULES, AND DEMONSTRATE THE COMBINED MOTOR AND ELECTRONICS OPERATING TOGETHER AT THE VENUS SURFACE TEMPERATURE. THE MOTOR AND DRIVE ELECTRONICS WILL THEN BE TESTED AT VENUS TEMPERATURE AND CHARACTERISTIC MEASUREMENTS INCLUDING POWER AND TORQUE WILL BE MONITORED USING HBR'S HIGH TEMPERATURE MOTOR CHARACTERIZATION SYSTEM. 500 HOURS OF OPERATION IS TARGETED FOR THIS EFFORT.. | $755K |
| Jul 26, 2019 | National Aeronautics and Space AdministrationNASA SHARED SERVICES CENTER | 80NSSC19C0348 | 541715 | NASA HAS DEMONSTRATED A RESOLVE TO LAND INSTRUMENTS ON THE CORROSIVE, HIGH-PRESSURE (~100 BAR), HIGH-TEMPERATURE (470 C) SURFACE OF VENUS. | $125K |
| Jun 11, 2019 | Department of DefenseFA8650 USAF AFMC AFRL PZL AFRL/PZL | FA865018C2039 | 541715 | IGF::OT::IGF PACKAGING AND ASSEMBLIES FOR HIGH-TEMPERATURE INTELLIGENT AEROSPACE CONTROLS - STTR II | $500K |
| Dec 12, 2018 | Department of DefenseFA8650 USAF AFMC AFRL PZL AFRL/PZL | FA865019P2036 | 541715 | HIGH TEMPERATURE BY DESIGN (HTBD) TECHNIQUES FOR A RELIABLE, HIGH PERFORMANCE, MICROCONTROLLER | $149K |
| Jul 26, 2018 | National Aeronautics and Space AdministrationNASA SHARED SERVICES CENTER | 80NSSC18P2089 | 541715 | NASA HAS DEMONSTRATED A RESOLVE FOR A FLAGSHIP MISSION IN THE COMING YEARS TO REVISIT VENUS AND LAND INSTRUMENTS ON THE SURFACE. VENUS HAS A CORROSIVE, HIGH-PRESSURE (~100 BAR), HIGH-TEMPERATURE (470 C) ENVIRONMENT. A MOTOR DRIVE IS THE MAJOR THEME THAT RUNS THROUGH THE MOST CRITICAL NEEDS FOR OPTIMUM GEOLOGICAL AND ATMOSPHERIC EXPLORATION ON VENUS. AN ELECTRONICALLY-CONTROLLED MOTOR, OPERATING AT 470 C/100 BAR, IS THE SINGLE MOST SIGNIFICANT DEMONSTRATION OF THE ABILITY TO PERFORM ROBOTIC VENUS SURFACE EXPLORATION AND THE ULTIMATE OBJECTIVE OF THE PROJECT. | $124K |
| Jul 26, 2018 | National Aeronautics and Space AdministrationNASA SHARED SERVICES CENTER | 80NSSC18P2208 | 541715 | NASA MANNED AND ROBOTIC MISSIONS TO THE SURFACE OF PLANETARY OR AIRLESS BODIES REQUIRE ENTRY, DESCENT, AND LANDING (EDL). FOR MANY OF THESE MISSIONS, EDL REPRESENTS ONE OF THE RISKIEST PHASES OF THE MISSION. DESPITE THE CRITICALITY OF THE EDL PHASE, NASA HAS HISTORICALLY GATHERED LIMITED ENGINEERING DATA FROM SUCH MISSIONS, AND USE OF THE DATA FOR REAL-TIME GUIDANCE, NAVIGATION AND CONTROL (GN&C) DURING EDL FOR PRECISE LANDING (ASIDE FROM EARTH) HAS ALSO BEEN LIMITED. NASA SCIENTISTS HAVE IDENTIFIED A COMPACT VACUUM ULTRAVIOLET SPECTROMETER AS A KEY ENHANCEMENT TO EDL SENSING. OZARK IC HAS DEVELOPED A FAR-ULTRAVIOLET FOCAL PLANE ARRAY (FPA) IN SIC BICMOS TECHNOLOGY. THE 159X64 PIXEL FPA HAS A SPECTRAL RESPONSE FROM 100[JH1] NM TO 350 NM. BICMOS TEST CIRCUITS IN THIS TECHNOLOGY HAVE DEMONSTRATED OPERATION FOR 100 HOURS AT 500 C SUGGESTING THIS FPA WILL NOT REQUIRE ANY ACTIVE COOLING TO OPERATE. THE KEY FEASIBILITY QUESTION TO BE ANSWERED IS: CAN THE HIGH-TEMPERATURE PACKAGING AND OPTICS BE DESIGNED WITH A MAXIMUM DIMENSION OF 10 CENTIMETERS? THE PRIMARY OBJECTIVE IS TO ANSWER THE FEASIBILITY QUESTION THROUGH A SERIES OF MEASUREMENT AND DESIGN TASKS. OZARK IC WILL DEVELOP SUPPORTING FPA FIRMWARE AND SOFTWARE FOR ENVIRONMENTAL TESTING OF THE FPA. LUMENFLOW WILL THEN DESIGN THE SPECTROMETER OPTICS FOR THE SMALLEST POSSIBLE FORM FACTOR. OZARK IC WILL APPLY IT S HIGH-TEMPERATURE CERAMIC PACKING SOLUTIONS TO DESIGN A HIGHTEMPERATURE SUBSTRATE AND CONNECTOR SYSTEM FOR THE SIC FPA AND INVESTIGATE ENCLOSURE MATERIALS. | $125K |
| May 2, 2018 | Department of DefenseFA8650 USAF AFMC AFRL PZL AFRL/PZL | FA865018C2039 | 541715 | IGF::OT::IGF PACKAGING AND ASSEMBLIES FOR HIGH-TEMPERATURE INTELLIGENT AEROSPACE CONTROLS - STTR II | $187K |
| Oct 19, 2017 | Department of DefenseFA8650 USAF AFMC AFRL PZL AFRL/PZL | FA865018C2039 | 541715 | IGF::OT::IGF PACKAGING AND ASSEMBLIES FOR HIGH-TEMPERATURE INTELLIGENT AEROSPACE CONTROLS - STTR II | $563K |
| Jul 14, 2016 | Department of DefenseFA8650 USAF AFMC AFRL PZL AFRL/PZL | FA865016P2711 | 541712 | IGF::OT::IGF LTCC PACKAGING AND ASSEMBLIES FOR LOW-COST, RELIABLE, HIGH-TEMPERATURE INTELLIGENT AEROSPACE CONTROLS | $150K |
| Jun 2, 2016 | National Aeronautics and Space AdministrationNASA SHARED SERVICES CENTER | NNX16CC85P | 541712 | IGF::OT::IGF NASA HAS DEMONSTRATED A RESOLVE FOR A FLAGSHIP MISSION IN THE COMING YEARS TO REVISIT VENUS AND LAND INSTRUMENTS ON THE SURFACE. VENUS HAS A CORROSIVE, HIGH PRESSURE (~100 BAR), HIGH-TEMPERATURE (UP TO 500 C) ENVIRONMENT PRESENTING EXTREME DESIGN CHALLENGES FOR LANDER ELECTRONICS. THE ABILITY TO ESTABLISH SIMPLE WIRE-LINE COMMUNICATIONS BETWEEN CIRCUITS OPERATING IN EXTREMELY DISPARATE TEMPERATURE DOMAINS IS A CRITICAL NEED. DIFFERENT TECHNOLOGIES HAVE SPECIFIC STRENGTHS (COMPLEXITY, DENSITY, AREA, POWER) WHICH SPAN FROM HIGH-PERFORMANCE, LOWER-TEMPERATURE SILICON TO MEDIUM-DENSITY SIC-CMOS AND LOWER-DENSITY, HIGH-RELIABILITY SIC JFET-R. A VIABLE LANDER DESIGN REQUIRES APPLYING THE RIGHT TECHNOLOGY TO EACH TEMPERATURE DOMAIN. THE PREMIER IC PROCESS FOR ULTRA-HIGH TEMPERATURES IS THE SIC JFET TECHNOLOGY DEVELOPED AT NASA GLENN RESEARCH CENTER (GRC). IN PHASE I, OZARK IC PROPOSES TO USE ITS EXTENSIVE HIGH TEMPERATURE DEVICE AND CIRCUIT EXPERTISE TO CREATE A PDK FOR THE GRC SIC JFET PROCESS. PRE-EXISTING DESIGNS BY NASA WILL BE RECAPTURED WITH THE PDK AND SIMULATION RESULTS WILL BE VALIDATED AGAINST MEASURED DATA. AN RS-485 TRANSCEIVER CIRCUIT WILL BE DESIGNED USING THE PDK AND VERIFIED SUCH THAT IT IS READY FOR FABRICATION AT THE CONCLUSION OF PHASE I. | $125K |
| Apr 20, 2016 | National Aeronautics and Space AdministrationNASA SHARED SERVICES CENTER | NNX16CG12C | 541712 | IGF::OT::IGF PHOTODIODE (APD) DETECTORS. THESE STATE-OF-THE-ART SIC PHOTODIODES USE THE WAFER SUBSTRATE AS ONE NODE OF THE DEVICE, THEREBY MAKING MONOLITHIC INTEGRATION OF THE DEVICE WITH CONTROL OR ANALYSIS CIRCUITRY DIFFICULT, IF NOT IMPOSSIBLE. IN PHASE I, OZARK IC DEMONSTRATED THAT ITS NEW (PATENT-PENDING) PHOTO DETECTING DEVICES ARE SUITABLE FOR INTEGRATION IN SIC-BASED LOW-VOLTAGE INTEGRATED CIRCUIT PROCESSES. BY VIRTUE OF THEIR CONSTRUCTION, THE PHOTO-GENERATION OCCURS EFFICIENTLY AND WITH VERY HIGH GAIN, AND THE DEVICES HAVE BEEN SHOWN TO OPERATE OVER A WIDE VOLTAGE (10-15 V) AND TEMPERATURE RANGE (-170 C TO 400 C MEASURED). OZARK IC'S EXTENSIVE LIBRARY OF SIC ANALOG AND MIXED-SIGNAL IP AND ITS EXPERTISE IN EXTREME-ENVIRONMENT IC DESIGN HAVE BEEN USED TO CREATE THE WORLD'S FIRST FULLY INTEGRATED 2-D UV IMAGER (UP TO 192 X 128 AT>10 FRAMES PER SECOND); READY FOR FABRICATION IN PHASE II. THE IMAGERS WILL BE TESTED ACROSS A WIDE RANGE OF TEMPERATURES TO DEMONSTRATE THEIR APPLICABILITY TO PLANETARY EXPLORATION, EARTH OBSERVATION AND ASTRONOMY APPLICATIONS | $754K |
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