Rugged Rack-Mounted Server Computers

QTY 2: Rugged Rack-Mounted Server Computer Technical Specifications Height shall be 3U or less Length shall be less than 22” Unit shall be air-cooled QTY Component 1 RS3700 SERIES SERVER (3U X 17.46"W X 19"D), AIR COOLED, RUGGED ALUMINUM CHASSIS 1 REDUNDANT 1200WAC POWER SUPPLY, 120/240VAC INPUT 1 MOTHERBOARD, SINGLE LGA6096, AMD EPYC™ 9004/9005 PROCESSORS, ATX, SUPERMICRO H14SSL-NT 1 PROCESSOR, LGA6096 SP5, 3.2/4.4 GHZ, 64 CORE, 6400 MHZ DDR5, 360W, AMD EPYC 9555 8 64GB MEMORY DIMM, RDIMM, DDR5, 6400MHZ 8 SSD, NVME U.2, 12.8TB, TCG OPAL, FIPS 140-3 1 SSD, SATA, 1.92TB, TCG-OPAL SED 2 MODULE, 3U, EXTENDED LENGTH HDD BRACKET, 4X MOUNTING HARDWARE 1 MODULE, DRIVE CARRIER, 2X SATA/SAS, 12VDC ONLY, HUMISEAL & STAKED 4 MODULE, DRIVE CARRIER, DUAL NVME/SATA, PCIE GEN 5, STACKING, MCIO, HUMISEAL, RESINLABS STAKING 1 MODULE, BLANK, VENTED, 1 SIZE D2 1 CARD, CONTROLLER, HBA, NVME, PCIE X16 GEN 5, LP, 2 PORT MCIO X8, PCI-E REDRIVER, MICRO SATA CABLES MCIO-2203-16X, HUMISEAL, RESINLABS STAKING 2 EDV-01405, CARD, NETWORK, 2 PORT, 100GB, QSFP, PCI-E 3.0/4.0 X16, LP, INTEL E810-CQDA2, HUMISEAL & STAKED 1 CARD, VIDEO, NVIDIA RTX PRO 6000 BLACKWELL MAX-Q WORKSTATION EDITION, 96GB GDDR7, 24064 CUDA CORES, 752 TENSOR CORES, 188 RT CORES, 4 DP 2.1, PCI-E 5.0 X16, FH, DUAL SLOT, 300W, 16 PIN CEM5 POWER, PNY VCNRTXPRO6000BQ-PB, HUMISEAL, RESINLABS STAKING 1 MODULE, TPM 2.0, FIPS 140-2, HORIZONTAL, FOR SUPERMICRO X13/H13 AND X14/H14 BOARDS WITH 10 PIN HEADER, SUPERMICRO, AOM-TPM-9672H-FIPS, HUMISEAL 1 KIT, RS/RCS SERIES, 20 IN RAIL MTG, JONATHAN, 19-22 IN & 25-28 IN 1 WARRANTY, PLATINUM 5 YEAR 1 CMS-00028 CM FEE, PLATINUM, MB, HDD, MEM, CPU, PS, DVD, METAL, FANS, APPROVED PERIPHERAL CARDS, AND UNIQUE ITEMS Environmental Requirements MIL-STD-810 Operational Temperature (High) Procedure II: +50°C, two-hour dwell, four cycles MIL-STD-810 Operational Temperature (Low) Procedure II: -30°C, two-hour dwell, four cycles MIL-STD-810 Altitude (Method 500) 12,500 ft. operation, 40,000 ft. transport MIL-STD-810 Thermal Shock (Method 503) Procedure II: 10 cycles, -40°C to +55°C, 15-min dwell, <1-min transfer time MIL-STD-810 Humidity (Method 507) Procedure II: 240 hours (with optional conformal coating kit) MIL-STD-810 Fungus (Method 508) 28 days, mixed spore, 30°C, 95% RH MIL-STD-810 Salt Fog (Method 509) 48-hour test MIL-STD-810 Sand & Dust (Method 510) Procedure I: Blasting dust, 12 hours MIL-STD-810 Acceleration (Method 513) Procedure II: 9g MIL-STD-810 Vibration (Method 514) Procedure I: 4.7G, 5-2,000Hz, 60 min/axis, 3-axis MIL-STD-810 Shock (Method 516) Procedures I & V: 40G, 11ms, 18 pulses, 3/axis both directions MIL-STD-1474E Acoustic Noise Requirement S, Grade A3 MIL-STD-167-1A Ship Vibration Type 1 MIL-S-901E Shipboard Shock Class II, Grade A/B Electromagnetic Compatibility Requirements MIL-STD-461 EMI/EMC RE102, CE102; surface ship, below deck, and ground RTCA/DO-160 Aircraft & Airborne Equipment Category M