THROUGH HOLE MINIATURE, MICROMINIATURE ELECTRONIC REPAIR STATION

DEPT OF DEFENSE

Notice type
Solicitation
Solicitation #
N0016426Q0239
NAICS
333515
PSC
3439
Set-aside
Total Small Business Set-Aside (FAR 19.5)
Posted
July 23, 2026
Response due
July 30, 2026
Place of performance
Crane, IN

What this opportunity is

The Department of Defense is seeking a Through Hole Miniature, Microminiature Electronic Repair Station, classified under NAICS 333515. This total small business set-aside opportunity is designed for small businesses capable of providing advanced soldering and desoldering equipment with specific technical features, including multiple thermal handpieces and self-contained pneumatics. Interested vendors should note that this is a solicitation notice, indicating that they will need to prepare a bid for consideration.

Analysis by Mindy, grounded in the SAM.gov notice.

Description

SALIENT CHARACTERISTICS Technical Specifications Parameter Specification Detail National Stock Number (NSN) 3439-01-395-4046 Fully codified for military logistics and supply chain systems . Input Power Requirements 97–127 VAC, 50/60 Hz Optimized for standard 115V/120V US electrical systems (120V Model) . Power Consumption 400 Watts maximum High thermal capacity for multi-layer board heatsinking . Simultaneous Channels 3 SensaTemp® Channels Powers and controls three thermal handpieces at the same time -- 1 of 5 -- . Temperature Range 176°C to 482°C Wide operational window for leaded and lead-free alloys . Temperature Stability at idle Prevents thermal overshoot and protects sensitive components. 2 Tip-to-Ground Resistance 2 Ohms or less Meets or exceeds ANSI-JSTD- 001 requirements for ESD protection . Internal Pumps 3 Separate Dedicated Pumps:• Pump 1: Desoldering, Hot Air, Thermal Pick• Pump 2: Solder Paste/Flux Dispensing• Pump 3: Pik-Vac Wand Ensures independent, reliable pneumatic -- 2 of 5 -- performance without interference . Vacuum Performance 20 in. Hg maximum (Vacuum Rise Time: 150– 200ms) Fast, clog-free desoldering vacuum response . Positive Air Pressure 7 psi maximum (Airflow: 13 SLPM max) Used for paste dispensing and hot air jet operations . Chassis Construction Extruded Aluminum with "T-Slots" Ultra-rugged, ESD-safe casing designed for bench or under-shelf mounting . Physical Footprint 175mm H x 350mm W x 230mm D Compact footprint for dense mobile work -- 3 of 5 -- benches. System Weight 13 kg (28.6 lbs) Heavy-duty benchtop unit . Salient & Key Features Feature Description & Benefit Thermal Management Center Utilizes SensaTemp® closed-loop feedback technology to deliver precise, ondemand heat to the joint while dynamically adjusting for high-mass ground planes . MicroChine Rotary Handpiece Features a dedicated miniature drilling and grinding handpiece for precision conformal coating removal (epoxy, urethane, silicone, acrylic, and parylene) and multilayer PCB excavation/delamination repair . Pulse Heat Technology Allows for controlled, specialized applications such as damage-free thermal wire stripping (including Teflon insulation) and lap-reflow soldering. 3 Self-Contained Pneumatics Completely eliminates the need for facility-supplied compressed air -- 4 of 5 -- . It features its own dedicated pressure pump for paste/flux dispensing, desoldering vacuum, and component handling. Operational Protections Includes continuous automatic calibration, a temperature setback/auto-o� safety system to preserve tip life, constant memory, and password protection to prevent unauthorized setting changes -- 5 of 5 --

Source: SAM.gov, as posted. Verify the current solicitation before responding.

Pursue this opportunity with Mindy

See who holds it now, who else is bidding, and draft your response — grounded in real government data, not generic AI.

View the original notice on SAM.gov ↗

Similar Active Opportunities (NAICS 333515)