What this opportunity is
The Department of Defense is seeking a Through Hole Miniature, Microminiature Electronic Repair Station, classified under NAICS 333515. This total small business set-aside opportunity is designed for small businesses capable of providing advanced soldering and desoldering equipment with specific technical features, including multiple thermal handpieces and self-contained pneumatics. Interested vendors should note that this is a solicitation notice, indicating that they will need to prepare a bid for consideration.
Analysis by Mindy, grounded in the SAM.gov notice.
Description
SALIENT CHARACTERISTICS
Technical Specifications
Parameter Specification Detail
National Stock
Number (NSN)
3439-01-395-4046 Fully codified for military
logistics and supply chain
systems
.
Input Power
Requirements
97–127 VAC, 50/60 Hz Optimized for standard
115V/120V US electrical
systems (120V Model)
.
Power
Consumption
400 Watts maximum High thermal capacity for
multi-layer board heatsinking
.
Simultaneous
Channels
3 SensaTemp® Channels Powers and controls three
thermal handpieces at the
same time
-- 1 of 5 --
.
Temperature
Range
176°C to 482°C Wide operational window
for leaded and lead-free
alloys
.
Temperature
Stability at
idle
Prevents thermal
overshoot and protects
sensitive components.
2
Tip-to-Ground
Resistance
2 Ohms or less Meets or exceeds ANSI-JSTD-
001 requirements for
ESD protection
.
Internal Pumps 3 Separate Dedicated Pumps:• Pump 1:
Desoldering, Hot Air, Thermal Pick• Pump 2:
Solder Paste/Flux Dispensing• Pump 3: Pik-Vac
Wand
Ensures independent,
reliable pneumatic
-- 2 of 5 --
performance without
interference
.
Vacuum
Performance
20 in. Hg maximum (Vacuum Rise Time: 150–
200ms)
Fast, clog-free desoldering
vacuum response
.
Positive Air
Pressure
7 psi maximum (Airflow: 13 SLPM max) Used for paste dispensing
and hot air jet operations
.
Chassis
Construction
Extruded Aluminum with "T-Slots" Ultra-rugged, ESD-safe
casing designed for bench
or under-shelf mounting
.
Physical
Footprint
175mm H x 350mm W x 230mm D
Compact footprint for
dense mobile work
-- 3 of 5 --
benches.
System Weight 13 kg (28.6 lbs) Heavy-duty benchtop unit
.
Salient & Key Features
Feature Description & Benefit
Thermal
Management
Center
Utilizes SensaTemp® closed-loop feedback technology to deliver precise, ondemand
heat to the joint while dynamically adjusting for high-mass ground
planes
.
MicroChine
Rotary Handpiece
Features a dedicated miniature drilling and grinding handpiece for
precision conformal coating removal (epoxy, urethane, silicone, acrylic, and
parylene) and multilayer PCB excavation/delamination repair
.
Pulse Heat
Technology
Allows for controlled, specialized applications such as damage-free thermal
wire stripping (including Teflon insulation) and lap-reflow soldering.
3
Self-Contained
Pneumatics
Completely eliminates the need for facility-supplied compressed air
-- 4 of 5 --
. It features its own dedicated pressure pump for paste/flux dispensing,
desoldering vacuum, and component handling.
Operational
Protections
Includes continuous automatic calibration, a temperature setback/auto-o�
safety system to preserve tip life, constant memory, and password protection to
prevent unauthorized setting changes
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Source: SAM.gov, as posted. Verify the current solicitation before responding.